Package Substrate Inspection System
Mold Substrate Inspection equipment designed for inspect defects that may occur on the top and bottom surfaces of package strip rolled out from the molding process - which is one of semiconductor package production processes. This product uses 2D/3D vision system to inspect incomplete mold, crack, exposed base metal and mold thickness on the top side mold and land contamination, PCB swelling, dent and heavy flash on the bottom side of PCB. This is an optical inspection equipment that combined 2D and 3D vision technologies to detect 3D quality defects which are difficult to catch detect in 2D inspection.
Stacked Package Inspection System
Stacked Package Inspection System is an optical vision inspection system intended to sort good and defected products by inspecting surface defects (package broken, void, misalign, PCB damage/broken, PCB peel off and metal exposure) and measuring 4 sides of package (total height, gap and misalign) after picking up the package mounted in boat after reflow process, which is conducted after stacking in the package assembly process.
Image Sensor Package Inspection System
CMOS Image Sensor Inspection System is an optical vision inspection system that inspects various external defects which occur in the sensor die top surface, pixel area, per unit for which die bonding is completed in PCB strip state during CIS package assembly process or inspects defects on cover glass surfaces which is top, bottom and die surface of package mounted on a tray as unit.
Wafer Inspection System
Wafer Defect Inspection System is an optical inspection equipment that inspects foreign material, broken, chip-out, scratch, PAD mark and discolor defects on wafer cell surface automatically.
Laser & Ink Marking Vision System
Laser & Ink Marking Vision System is a PC-based standalone system comprised of the ID vision that identifies the marking-position data of the selected marks on the PCB surfaces of frames to send the data to the laser system and transmitting the frame information to the server after reading the 2D barcode, and the mark vision that identifies the presence of abnormal marks by recognizing the brands and histories of the semiconductor products recorded on the surfaces of IC packages using the vision camera. This system performs real-time inspection in the in-line processes before and after marking work, preceded by being installed on various types of IC marking device.
BGA Ball Placement Vision System
BGA Ball Placement Vision System is a PC-based stand-alone vision system comprised of the QC vision designed for inspecting quality and checking for the presence of balls of frames placed on ball lands after performing ball tool visioning and ball attachment for inspecting quality and checking for the presence of the balls of ball tools, and the align vision that is used for transmitting offset values (positions, angles) different from the original positions by inspecting align marks with the vision in order for the balls of CSP(chip scale package)-family devices to be moved to accurate target positions after calibrating the positions and angles between the ball tools and the PCBs prior to placing the balls on the ball lands.
Off-Loader BGA Ball Vision System
Off-Loader BGA Ball Vision System is a PC-based standalone vision system designed for checking for the presence of balls, and inspecting quality, which is positions, sizes and etc., after it being installed on the facilities used in the process of holding frames with ball lands to which balls are completely attached into magazines after passing through a reflow after attaching the balls.
Laser Drilling Vision System
Laser Drilling Vision System is a PC based stand-alone vision system comprising ID vision recognizing the select mark on the PCB side surface of the frame via vision camera and transmits good and reject position data for the package to the laser system. The align vision inspects the alignment mark and transmits its offset position and rotation values to the equipment to process holes by laser at the precise target positions on the EMC molding area, and QC vision that inspects the quality of processed holes, balls and pad surfaces after laser drilling to automatically identify defects.
BGA SAW & Sort Vision System
BGA Saw & Sort Vision System is a PC-based standalone vision system that performs different types of vision inspection routines after being attached in-line to the M/Cs in the saw and sort processes, wherein the frames of CSP (chip scale package) materials are sliced into IC packages and arranged in trays. This consists of inlet vision that performs directional inspection for correct insertion of material before sawing, ball vision which inspects existence, quality, position and package size of ball attached to each package product after sawing, and mark vision that automatically determines abnormality of marking state.
BGA Singulation Vision System
BGA Singulation Vision System is a PC-based independent vision system attached to a process equipment which presses IC package on the BGA material frame for separation into single package to perform various vision inspections. It consists of mark vision that automatically determines abnormality of marking state by recognizing marks about product trademark and history recorded on the IC package surface, ball vision which inspects ball attached to each package product separated from the frame, and chip vision that inspects the size and surface status of chip.
Tray Sorting Vision System
Tray Sorting Vision System is a PC based stand-alone vision system comprising ID vision recognizing characters imprinted on the tray tap and transmits them to the server. The line scan vision checks the IC package presence, position deviation and EMC surface marking for the whole tray to automatically identify and sort defects.
Tape & Reel Vision System
Tape & Reel Vision System is a PC-based standalone vision system that detects the presence of abnormal marks printed on products and recognize index holes on the surfaces of mold packages, while performing lead quality inspection targeted at IC packages prior to packaging after being attached to tape and reel facilities, which are used for the final packing process in which assembled IC packages are wound around reels after being held in tapes.
Trim Vision System
Trim Vision System is a PC-based standalone system that checks automatically for the presence of defective items by inspecting the quality of leads and dambars before and after trim processes, wherein junks and dambars linked to the gaps between the lead frames and leads are removed. Various types of lead trim systems are equipped with this system in order to perform real-time inspection in in-line processes before and after trimming and transmitting the inspection results.