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Package Substrate Inspection System
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| Mold Substrate Inspection equipment designed for inspect defects that may occur on the top and bottom surfaces of package strip rolled out from the molding process - which is one of semiconductor package production processes. This product uses 2D/3D vision system to inspect incomplete mold, crack, exposed base metal and mold thickness on the top side mold and land contamination, PCB swelling, dent and heavy flash on the bottom side of PCB. This is an optical inspection equipment that combined 2D and 3D vision technologies to detect 3D quality defects which are difficult to catch detect in 2D inspection. |
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