FC Bump Inspection System
FC Bump Inspection System is a type of equipment designed for inspecting the quality of FC bumps printed in the manufacturing processes of flip chip bump substrates or packages, and the quality of bumps is inspected by measuring the height, diameters, X/Y positions and etc., before and after a printing process.
PCB Surface Inspection Vision System
PCB Surface Inspection Vision System is able to inspect the scratches and reject marks on the surfaces of PCBs prior to molding work in the manufacturing processes of semiconductor substrates, while selecting materials by identifying the ID and mapping information marked on the outer and inner surfaces of the PCB. The identified mapping information is sent to the subsequent process and is used for determining whether to proceed to the next process.
PCB Laser Marking Vision System
PCB Laser Marking Vision System performs recognition inspection targeted at marking positions reserved for marking defective devices on PCBs by unit prior to molding work in the manufacturing processes of semiconductor substrates. The scratches, reject marks, and ID mapping information existing in and out of the units are identified to select materials to be marked. As this system is capable of automatically identifying marking positions measured in a few µm, there is no need for teaching the marking positions manually. Ultimately, the teaching time required for new devices are greatly reduced.