CMOS Wafer Inspection System (WAOI Master 4000) |
|
|
 |
| This system is an optical inspection system which
inspects the particles on the surface of CMOS Wafer,
surface scratch defect, pad marking, ink marking
or dead pixel automatically. This inspection system
is composed of the cassette part in which the users
can load and unload the full cassette with the wafer,
the wafer loading/unloading part in which the users
pick out the wafer to inspect from the cassette
to and put it on the chuck or put the wafer of which
inspection is completed on the cassette, the align
vision part which compensates the deviation of wafer’s
X, Y axis, rotation (theta) and height(z) to ensure
that the inspection is performed correctly, and
inspection vision part which takes the image by
scanning the wafer in sequence and performs the
inspection. According to the needs of operators,
it provides the additional function to be able to
review the defect inspected by the inspection system |
|
|
|
| |
 |
⊙ High precision inspection and safe operation
of system by high precision automatic alignment
(repetition precision: less than 2um)
⊙ High precision detection for minute defect (about
3um level)
⊙ Performance of high precision inspection regardless
of Wafer Warpage
⊙ Automatic inspection and sharing the
former / latter before/after process data
⊙ Defect cell map & review function
⊙ Function to review and analyze the data and analy
by division, date, time and type of defect (SPC
function)
⊙ Adoption of best hardware specification for establishment
of high precision and powerful function and performance. |
|
|
|
 |
|
 |
|
Items |
Specification |
|
| Inpection
Device |
6",
8”, 12" wafer or wafer ring after/before singulation |
| Inspection
Items |
Foreign
material, Scratch, Dead pixel, Ink mark , Pad Marking
etc. |
| Camera
Type |
Color
CCD Camera, 24profile/Sec |
| Inspection
Time |
25min
per wafer with 749 ea Cells |
| Control
Resolution |
0.5
μm (X, Y, Z, Theta) |
| Accuracy
(Chuck Planarity/Temp.) |
±2㎛
(10㎛(Std), 20㎛ / Ambient to 130°C) |
| Process
Control |
SPC
Software |
| PC
(2) |
Over
PentiumIV 2.0GHz / 512Mbyte Memory,High Performance
Graphic Card |
| Monitor
(2) |
Over
1024 × 768 Resolution (Touch Screen) |
| OS |
Windows
2000 or XP |
| Dimensions |
1680(W)
x 1300(D) x 2100(H) mm (except Tower Lamp) |
| Weight |
1400
kgf |
| Main
Power |
220
VAC (+-10%) / 60 Hz / 4 kW (Single Phase) |
| ※
The above mentioned specification of PC is recommended
to use the system optimally. |
| ※
The content and details of this specification may
be changed without notification to improve the performance
and quality. |
|
|
|
|
| |
|
