Synapse Imaging is leader in vision inspection, visual inspection machine and machine vision system.
With expertise in inspection system of 3D measurement and 3D inspection, we manufacture semiconductor inspection, SMT and TFT-LCD inspection systems including solder paste inspection, solder paste measurement, PCB inspection system, wafer inspection system, wafer probe inspection system, IC package inspection and LCD inspection equipment.

 
 
 
 
 
 
 
 
 
 
Synapse News
The Trade News
Map
Employment
CMOS Wafer Inspection
Wafer Probe Mark Inspection
 
Partnership
Question
Dataroom
Album
Catalog
Homepage Modify & Production
Synapse News
The Trade News
 
 
  >> Product Info >> Wafer >> Wafer Probe Mark Inspection System

Wafer Probe Mark Inspection System

 

Wafer Probe Mark Inspection System (WAOI Master 3000)

 
Wafer Probe Mark Inspection System (WAOI Master 3000)
 
This system is optical inspection system which inspects the pad marking and ink marking of Wafer surface automatically. This inspection system is composed of the wafer cassette part, wafer loading/unloading part, high magnification vision align part, inspection control part and inspection vision part. According to the needs of operator, it includes the review function to be able to review the defect inspected by the inspection system and manual inspection function needed for precision inspections for pattern or pad surface in high magnification.
 
¢Á High precision inspection and safe operation of system by high precision automatic alignment (repetition precision: less than 2um)
¢Á High precision detection for minute pattern (about 3um detection level with application of x50 lens)
¢Á Performance of high precision inspection regardless of Wafer Warpage
¢Á Automatic inspection and sharing the former / latter process data
¢Á Review function for bad cell and high precision manual inspection
¢Á Function to review and analyze the data by division, date, time and type of defect (SPC function - option)
¢Á Adoption of best hardware specification for establishment of high precision and powerful function and performance.
  Product Characteristics
 
Items
Specification
Inpection Device 6", 8¡±, 12" wafer or wafer ring after/before singulation
Inspection Items Auto : Ink mark , Pad Marking etc.Manual : Fine Patern, Ink Marking & Pad Marking etc.
Camera Type Color CCD Camera, 24profile/Sec
Inspection Time
(PM Inspection Time)
1 hour per wafer with 500 ea Cells(Pad Marking with Pad of 100 ea per Cell)
Control Resolution 0.5 ¥ìm (X, Y, Z, Theta)
Accuracy
(Chuck Planarity/Temp.)
¡¾2§­ (10§­(Std), 20§­ / Ambient to 130¡ÆC)
Process Control SPC Software (Option)
PC (2´ë) Over PentiumIV 2.0GHz / 512Mbyte Memory,High Performance Graphic Card
Monitor (2 ´ë) Over 1024 ¡¿ 768 Resolution (Touch Screen)
OS Windows 2000 or XP
Dimensions Vision System : 1480(W) x 1300(D) x 1600(H) mmControl Box : 600(W) x 750(D) x 1850(H) mm
Weight (Cont. Box) 1200 kgf (250 kgf)
Main Power 220 VAC (+-10%) / 60 Hz / 4 kW (Single Phase)
¡Ø The above mentioned specification of PC is recommended to use the system optimally.
¡Ø The content and details of this specification may be changed without notification to improve the performance and quality.
 
 
 
Sitemap Korean Contact Us
Synapse Imaging