Ball Attachment |
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| This system is a PC based stand-alone vision system
which performs various vision inspections and it
is equipped as a In-Line type to the M/C that handles
the process of attaching the ball to IC package
on the frame of CSP (Chip Scale Package). It is
a vision system which inspects the location and
angle of frame to attach the ball on the correct
location before attaching the ball and transports
the deviation to the equipment, inspects the existence
of ball on the tool and its quality, and inspects
if the ball is attached or not and its quality,
location and size. |
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⊙ Easy gradual training by using
⊙ Measurement and inspection of high precision align
and ball dimension by level of μm
⊙ Auto Training: With only assignment of area, it
is possible to extract the parameter and to compensate
the inspection parameter automatically
⊙ Implementation of highly throughput by high speed
process
⊙ Highly reliable inspection function regardless
of location of device and rotation of device
⊙ Auto Conversion: automatic response to the change
of device and lot by receiving the model code means
of I/O or RS-232C communication |
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Items |
Specification |
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| Resolution |
640X480
~ 1300X1030 Pixels |
| Illumination |
Specially
designed LED light guide |
| Illumination
Control |
Regular
Illumination or Strobe |
| Regular
Illumination |
I/O
or RS-232C |
| Inspection
Item |
Align
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ㆍOrientation
ㆍAlign Measurement
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Position
- Angle
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| Ball
Tool |
ㆍMissing
Ball
ㆍExtra/Double Ball
ㆍBall Size
ㆍDamage Ball |
| Ball |
ㆍMissing
Ball
ㆍExtra/Double Ball
ㆍBall Size
ㆍDamage Ball
ㆍBall Pitch/Position
ㆍPackage Dimension
ㆍ'X' Mark |
| Application
Device |
PBGA,
FBGA, TBGA, WBGA, HBGA, FCBGA, μBGA |
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