BGA saw &-Sort |
|
|
 |
| This system is a PC based stand-alone vision system
which performs various vision inspections and it
is equipped as the type of in-line to the M/C of
Saw & Sort process that aligns the frame of
material to the tray after cutting with IC Package.
It is composed of inlet vision which inspects the
side and direction for inputting the material correctly
before sawing a ball vision which inspects the existence,
ball , quality, location of ball attached to each
package product and size of package and mark vision
which determine whether there is defect in the mark
or not. |
|
|
|
| |
 |
⊙ Easy gradual training by using of Train Wizard
⊙ Auto Training: it is possible to extract the,
character ball and package area, and to compensate
the parameter automatically
⊙ Measurement of the dimension of ball and package
with some μm level of high precision
⊙ It is possible to, location, direction and quality
with high level of reliability
It is possible to inspect the highly reliability
regardless of location of device and vibration changes
⊙ It is possible to realize the highly throughput
by high speed inspection
⊙ Both data sorting function per inspection item
⊙ Inspection function if there is MCP(Multi Chip
Package)
⊙ Auto Conversion: automatic response to the device
and lot by receiving the model code with I/O or
RS-232C communication |
|
|
|
 |
|
|
 |
|
|
|
 |
|
Items |
Description |
|
| Resolution |
640X480
~ 1300X1030 Pixels |
| Illumination |
Specially
designed LED light guide |
| Illumination
Control |
Strobe
|
| Interface |
I/O
or RS-232C |
| Inspection
Item |
Align
|
ㆍOrientation
ㆍTurn Over |
| Ball |
ㆍMissing
Ball
ㆍExtra/Double Ball
ㆍBall Size
ㆍDamage Ball
ㆍBall Pitch/Position
ㆍPackage Dimension
ㆍMis-Align
ㆍ'X' Mark
|
| Mark |
ㆍNo Mark
ㆍExtra Mark
ㆍTilted/Mis-Align Mark
ㆍReverse Mark
ㆍMark Size
ㆍThickness Defect
ㆍBroken/Splash Mark
ㆍPoor Contrast Mark
ㆍScratch Surface/'X' Mark |
| Application
Device |
FBGA,
TBGA, WBGA, HBGA, FCBGA |
|
|
| |
|
