Synapse Imaging is leader in vision inspection, visual inspection machine and machine vision system.
With expertise in inspection system of 3D measurement and 3D inspection, we manufacture semiconductor inspection, SMT and TFT-LCD inspection systems including solder paste inspection, solder paste measurement, PCB inspection system, wafer inspection system, wafer probe inspection system, IC package inspection and LCD inspection equipment.

>> Product Info >> SMT >> Solder Paste Inspection(In-line)

Solder Paste Inspection(In-line)

Solder Paste Inspection(In-Line)

With higher measurement resolution than laser triangulation technology, wider measurement range than Moire technology and faster inspection speed by on-the-fly imaging technology, FAHP (Flying Absolute Height Profilometry) technology features outstanding 3D measurement performance beyond state of the art 3D technologies. Moreover, structured dual light sources totally eliminate volume measurement errors caused by shadow effect. Based on the FAHP technology, 3D XPi 4000 overcomes all limitations of other SPI systems by realizing more accurate and reliable solder paste inspection at faster speed for all types of pad, package and PCB.

⊙ World fastest inspection speed @ zero shadow effect.
⊙ On-the-fly 3D image acquisition.
⊙ Entire shadow effect elimination by structured dual light sources.
⊙ True volume measurement of solder paste without pad offset effect
⊙ Perfect PCB warpage compensation by true warpage measurement.
⊙ Lowest vibration by scan mechanism and high stability by linear motor.
⊙ Compact design with minimized foot print.

Easy off-line programming by auto conversion of Gerber & CAD data.
On-site defect review available.
Real-time process monitoring and alarm signal generation.
Real-time SPC software for process monitoring and defect analysis.

Synapse’s 3D XPi 4000 measures true height and volume of solder paste free from erroneous effects by shadow and pad offset. Based on the measurements, it eliminates 100% defects regardless of types or sizes of pads in the market within production cycle time. Through the feedback of inspection results to screen printer, it enables you to improve yield and long-term reliability of solder joint in the most economic way. It also enables you to save assembly cost by reducing repair cost with earlier defect detection before reflow.

Items	3D XPi 4000	3D XPi 4000L

Measurement Method	No shadow effect 3D FAHP (Flying Absolute Height Profilometry)
Inspection Items	Height, Volume, Area, Bridge, Shape, Position
Inspection Speed	20㎠/sec (without shadow effect)
Measurement Repeatability	Height : < 1 % @ standard certification target
	Volume : < 1% @ standard certification target
% Gage R&R	<10%
Measurement Accuracy	Height : < 2%@ standard certification target
Resolution	0.1 ㎛ height resolution
Solder Paste Size	Max. Size: up to 5,000㎛
	Max. Height: up to 1,000 ㎛
PCB Warpage	Max. ±3.5mm
Job Programming	Automatic programming from Gerber & CAD data
SPC Software	ㆍCapability chart / Cp, Cpk, Cpm, Cr ㆍTrend chart /X bar-R/S chart/Scatter diagram ㆍDefect Analysis : C/U/Yield charts/Defect pareto ㆍSystem run histories ㆍProcess alarm generation
Defect Review	Batch operation up to 5 B/Ds, Optional NG buffer
Conveyor System	SMEMA/JEDEC Standard, Motorized Width Control
Board Thickness	0.4~5.0mm
Board Size	330(L) X 250 (D) mm	510(L) X 460 (D) mm
Board Clearance	Upward:25mm, Downward:30mm, Edge: 3mm
Computer system	Windows XP Professional, 17” TFT-LCD
Operation Temperature	5~30°C
Power & Air	Single Phase 220V & 5 bar
Dimension	820(L) X 880(D) X1380(H) mm	950(L) X 1290(D) X1400(H) mm
Weight	500 Kg	750 Kg

* The specifications in the above can be changed without notice due to improvement.